![]() ![]() Advertised PPA Improvements of New Process Technologiesĭata announced during conference calls, events, press briefings and press releasesĬompared to it’s N5 node, N3 promises to improve performance by 10-15% at the same power levels, or reduce power by 25-30% at the same transistor speeds. We’ve heard that TSMC had been working on defining the node back last year with progress going well.Ĭontrary to Samsung’s 3nm process node which makes use of GAA (Gate-all-around) transistor structures, TSMC will instead be sticking with FinFET transistors and relying on “innovative features” to enable them to achieve the full-node scaling that N3 promises to bring. Today’s biggest news was TSMC’s disclosure on their next big leap past the N5 process node generation family, which is the 3nm N3 node. We’ll be seeing N4 risk production start in 4Q21 for volume production later in 2022. The foundry is preparing a new N5P node that’s based on the current N5 process that extends its performance and power efficiency with a 5% speed gain and a 10% power reduction.īeyond N5P, TSMC is also introducing the N4 node that represents a further evolution from the N5 process, employing further EUV layers to reduce masks, with minimal migration work required by chip designers. ![]() TSMC details that N5 currently is progressing with defect densities one quarter ahead of N7, with the new node having better yields at the time of mass production than both their predecessor major nodes N7 and N10, with a projected defect density that’s supposed to continue to improve past the historic trends of the last two generations. TSMC has been in mass production for several months now as we’re expecting silicon shipping to customers at this moment with consumer products shipping this year – Apple’s next-generation SoCs being the likely first candidates for the node. Starting off with TSMC’s upcoming N5 process node which represents its 2 nd generation deep-ultraviolet (DUV) and extreme-ultraviolet (EUV) process node after the rarely used N7+ node (Used by the Kirin 990 SoC for example). ![]() At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the form of N5P and N4 process nodes. ![]()
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